TEA1118M/C2

Specifications

Supply Currentmax

1.4 mA

Ihs Manufacturer

NXP SEMICONDUCTORS

Package Body Material

PLASTIC/EPOXY

Fonksiyon Sayısı

1

Part Package Code

SOIC

Jesd30 Code

R-PDSO-G16

Terminal Pozisyonu

DUAL

Yüzey Montaj

YES

Uzunluk

5.2 mm

Operating Temperaturemin

-25 °C

Package Style

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

Terminal Formu

GULL WING

REACH Uyumluluk Kodu

unknown

Telecom Ic Type

CORDLESS TELEPHONE BASEBAND CIRCUIT

Package Shape

RECTANGULAR

Part Life Cycle Code

Obsolete

Number Of Terminals

16

Temperature Grade

COMMERCIAL EXTENDED

Genişlik

4.4 mm

Terminal Adımı

0.65 mm

Package Code

LSSOP

Operating Temperaturemax

75 °C

Seated Heightmax

1.5 mm

Pin Sayısı

16

Package Description

PLASTIC, SOT-369, SSOP-16

HTS Kodu

8542.39.00.01

Supply Voltagenom

2.9 V

Qualification Status

Not Qualified