PX1011BI-EL1/G

Specifications

REACH Uyumluluk Kodu

unknown

Seated Heightmax

1.6 mm

Package Shape

SQUARE

HTS Kodu

8542.39.00.01

Ihs Manufacturer

NXP SEMICONDUCTORS

Jesd30 Code

S-PBGA-B81

Temperature Grade

INDUSTRIAL

Part Package Code

BGA

Operating Temperaturemin

-40 °C

Package Style

GRID ARRAY, LOW PROFILE, FINE PITCH

Terminal Kaplaması

Tin/Silver/Copper (Sn/Ag/Cu)

Package Description

LFBGA,

Yüzey Montaj

YES

Moisture Sensitivity Levels

3

Tepe Reflow Sıcaklığı (°C)

260

JESD-609 Kodu

e1

Number Of Terminals

81

Uzunluk

9 mm

Telecom Ic Type

INTERFACE CIRCUIT

Manufacturer Package Code

SOT-643-1

Package Body Material

PLASTIC/EPOXY

Pin Sayısı

81

Fonksiyon Sayısı

1

Operating Temperaturemax

85 °C

Qualification Status

Not Qualified

Terminal Pozisyonu

BOTTOM

Part Life Cycle Code

Obsolete

Terminal Formu

BALL

Supply Voltagenom

1.2 V

Rohs Code

Yes

Tepe Reflow Süresi (maks. sn)

30

Package Code

LFBGA

Genişlik

9 mm

Terminal Adımı

0.8 mm