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Support
Technical team support
Specifications
- Temperature Grade
- COMMERCIAL
- Part Package Code
- BGA
- Ihs Manufacturer
- NXP SEMICONDUCTORS
- Jesd30 Code
- S-PBGA-B81
- Seated Heightmax
- 1.6 mm
- REACH Uyumluluk Kodu
- unknown
- Package Shape
- SQUARE
- HTS Kodu
- 8542.39.00.01
- Yüzey Montaj
- YES
- Moisture Sensitivity Levels
- 3
- Tepe Reflow Sıcaklığı (°C)
- NOT SPECIFIED
- Package Description
- 9 X 9 MM, 1.05 MM HEIGHT, PLASTIC, MO-205, SOT643-1, LFBGA-81
- Package Style
- GRID ARRAY, LOW PROFILE, FINE PITCH
- Part Life Cycle Code
- Obsolete
- Terminal Pozisyonu
- BOTTOM
- Fonksiyon Sayısı
- 1
- Pin Sayısı
- 81
- Operating Temperaturemax
- 70 °C
- Qualification Status
- Not Qualified
- Telecom Ic Type
- INTERFACE CIRCUIT
- Uzunluk
- 9 mm
- Number Of Terminals
- 81
- Package Body Material
- PLASTIC/EPOXY
- Kurşunsuz Kodu
- No
- Manufacturer Package Code
- SOT-643-1
- Rohs Code
- No
- Genişlik
- 9 mm
- Package Code
- LFBGA
- Tepe Reflow Süresi (maks. sn)
- NOT SPECIFIED
- Terminal Adımı
- 0.8 mm
- Supply Voltagenom
- 1.2 V
- Terminal Formu
- BALL
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