Shipping
Same-day dispatch from stock
Genuine parts
Verified sourcing
RoHS
Compliant
Support
Technical team support
Specifications
- Terminal Adımı
- 1.27 mm
- Bit Size
- 32
- Package Code
- BGA
- Upsucsperipheral Ics Type
- MICROPROCESSOR, RISC
- Yüzey Montaj
- YES
- Speed
- 1000 MHz
- Package Body Material
- CERAMIC
- Qualification Status
- Not Qualified
- Package Shape
- SQUARE
- Terminal Pozisyonu
- BOTTOM
- Jesd30 Code
- S-XBGA-B360
- Ihs Manufacturer
- NXP SEMICONDUCTORS
- REACH Uyumluluk Kodu
- unknown
- Package Style
- GRID ARRAY
- Package Equivalence Code
- BGA360,19X19,50
- Package Description
- ,
- Number Of Terminals
- 360
- Terminal Formu
- BALL
- Part Life Cycle Code
- Active
- HTS Kodu
- 8542.31.00.01
Related Products
In Stock
Schneider
0M-3774
Microprocessors
In Stock
NVE Corporation
0M-92634
Microprocessors
In Stock
AMD
100-438158
Microprocessors
In Stock
AMD
100-438275
Microprocessors
In Stock
Microchip
160096
Microprocessors
Digi
16051220
Microprocessors
In Stock
Microchip
161167
Microprocessors
In Stock
Microchip
183904
Microprocessors

