Shipping
Same-day dispatch from stock
Genuine parts
Verified sourcing
RoHS
Compliant
Support
Technical team support
Specifications
- Supply Voltagemax Vsup
- 5.25 V
- Terminal Pozisyonu
- DUAL
- Terminal Kaplaması
- TIN LEAD
- Terminal Adımı
- 2.54 mm
- REACH Uyumluluk Kodu
- unknown
- Yüzey Montaj
- NO
- Operating Mode
- ASYNCHRONOUS
- Equivalent
- POS-60
- Number Of Words Code
- 512
- Package Body Material
- CERAMIC, GLASS-SEALED
- Package Shape
- RECTANGULAR
- Organization
- 512X4
- Output Characteristics
- 3-STATE
- Fonksiyon Sayısı
- 1
- Temperature Grade
- COMMERCIAL EXTENDED
- Number Of Words
- 512 words
- Package Code
- DIP
- Memory Width
- 4
- Operating Temperaturemax
- 75 °C
- ECCN Kodu
- EAR99
- JESD-609 Kodu
- e0
- Supply Voltagenom Vsup
- 5 V
- Composition
- tin - 60%; lead - 40%
- Package Style
- IN-LINE
- Number Of Terminals
- 16
- Tip
- Soft tin-lead solder Sn/Pb
- Parallelserial
- PARALLEL
- Access Timemax
- 50 ns
- Qualification Status
- Not Qualified
- Weight
- 0.25 kg
- Terminal Formu
- THROUGH-HOLE
- Memory Ic Type
- OTP ROM
- Soldering Temperature
- 250...265 °C
- Supply Voltagemin Vsup
- 4.75 V
- Ihs Manufacturer
- NXP SEMICONDUCTORS
- Çap
- 0.5 mm
- Transport Packaging Sizequantity
- 28*25*35/100
- Package Equivalence Code
- DIP16,.3
- Form
- wire
- Ambalaj
- reel
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