MIMX8DX5AVLFZAC

Specifications

Part Life Cycle Code

Active

Tepe Reflow Sıcaklığı (°C)

260

Package Code

FBGA

Tepe Reflow Süresi (maks. sn)

40

Terminal Pozisyonu

BOTTOM

ECCN Kodu

5A992.C

Upsucsperipheral Ics Type

SoC

Uzunluk

21 mm

Rohs Code

Yes

Package Shape

SQUARE

Package Body Material

PLASTIC/EPOXY

Moisture Sensitivity Levels

3

Genişlik

21 mm

Supply Voltagemax

1.15 V

Package Description

FCBGA-609

Ihs Manufacturer

NXP SEMICONDUCTORS

Package Style

GRID ARRAY, FINE PITCH

Jesd30 Code

S-PBGA-B609

REACH Uyumluluk Kodu

compliant

HTS Kodu

8542.31.00.01

Operating Temperaturemin

-40 °C

Terminal Adımı

0.8 mm

Package Equivalence Code

BGA609,35X35,32

Temperature Grade

AUTOMOTIVE

Supply Voltagenom

1.1 V

Terminal Formu

BALL

Seated Heightmax

2.52 mm

Yüzey Montaj

YES

Number Of Terminals

609

Operating Temperaturemax

125 °C

Supply Voltagemin

1.05 V

Fabrika Tedarik Süresi

26 Weeks

Date Of Intro

2020-04-09