BLS7G3135LS-200

Specifications

Package Description

,

Number Of Elements Per Chip

1

Typical Power Gain Db

10

Ihs Manufacturer

NXP SEMICONDUCTORS

Tepe Reflow Sıcaklığı (°C)

NOT SPECIFIED

Package Width

9.91(Max)

Maximum Operating Temperature C

225

Üretici Parça No

BLS7G3135LS-200

Supplier Package

SOT-502B

Process Technology

LDMOS

Typical Drain Efficiency

43

Pin Sayısı

3

Channel Type

N

Rohs Code

Yes

REACH Uyumluluk Kodu

unknown

Package Height

4.72(Max)

Maximum Frequency Mhz

3500

Mounting

Surface Mount

Risk Rank

5.78

Package Length

20.7(Max)

Eccn Us

EAR99

Output Power W

200(Typ)

Maximum Drain Source Voltage V

65

Parça Durumu

NRND

Mode Of Operation

Pulsed RF

Military

No

Pcb Changed

3

Minimum Frequency Mhz

3100

Configuration

Single

Reflow Temperaturemax S

NOT SPECIFIED

Minimum Operating Temperature C

-65

Part Life Cycle Code

Transferred

Maximum Gate Source Voltage V

13

Channel Mode

Enhancement

RoHS Durumu

RoHS Compliant