BLF6G22LS-75

Specifications

Rohs Code

Yes

Package Shape

RECTANGULAR

Case Connection

SOURCE

Configuration

SINGLE

ECCN Kodu

EAR99

Package Description

ROHS COMPLIANT, CERAMIC PACKAGE-2

Package Body Material

CERAMIC, METAL-SEALED COFIRED

Additional Feature

ESD PROTECTED

Tepe Reflow Sıcaklığı (°C)

NOT SPECIFIED

Drain Currentmax Id

18 A

Transistor Element Material

SILICON

Number Of Terminals

2

Highest Frequency Band

S BAND

Ihs Manufacturer

NXP SEMICONDUCTORS

Ds Breakdown Voltagemin

65 V

Number Of Elements

1

Yüzey Montaj

YES

Package Style

FLATPACK

Operating Mode

ENHANCEMENT MODE

Jesd30 Code

R-CDFP-F2

Part Life Cycle Code

Obsolete

REACH Uyumluluk Kodu

unknown

Tepe Reflow Süresi (maks. sn)

NOT SPECIFIED

Polaritychannel Type

N-CHANNEL

Terminal Formu

FLAT

Pin Sayısı

2

Transistor Application

AMPLIFIER

Qualification Status

Not Qualified

Terminal Pozisyonu

DUAL

Fet Technology

METAL-OXIDE SEMICONDUCTOR