BGS8L2

Specifications

HTS Kodu

8542.39.00.01

Package Shape

RECTANGULAR

Operating Temperaturemax

85 °C

Package Code

BCC

Package Style

CHIP CARRIER

Supply Voltagenom

1.8 V

Ihs Manufacturer

NXP SEMICONDUCTORS

Telecom Ic Type

RF FRONT END CIRCUIT

Genişlik

0.7 mm

Temperature Grade

INDUSTRIAL

Seated Heightmax

0.4 mm

Uzunluk

1.1 mm

REACH Uyumluluk Kodu

unknown

Terminal Formu

BUTT

Terminal Adımı

0.4 mm

Part Life Cycle Code

Not Recommended

Package Description

BCC,

Yüzey Montaj

YES

Jesd30 Code

R-PBCC-B6

Number Of Terminals

6

Fonksiyon Sayısı

1

Operating Temperaturemin

-40 °C

Package Body Material

PLASTIC/EPOXY

Terminal Pozisyonu

BOTTOM