74LVC1G74DC

Specifications

Operating Temperaturemax

125 °C

Package Style

SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH

Genişlik

2 mm

Family

LVC/LCX/Z

Package Body Material

PLASTIC/EPOXY

Logic Ic Type

D FLIP-FLOP

Number Of Bits

1

Packing Method

TR

Prop Delaynomsup

5.9 ns

Trigger Type

POSITIVE EDGE

Yüzey Montaj

YES

Tepe Reflow Süresi (maks. sn)

30

Seated Heightmax

1 mm

Max Iol

0.024 A

Fmaxmin

200 MHz

Rohs Code

Yes

Saturation Current

1

Terminal Kaplaması

Nickel/Palladium/Gold (Ni/Pd/Au)

JESD-609 Kodu

e4

Package Shape

RECTANGULAR

Qualification Status

Not Qualified

Pin Sayısı

8

HTS Kodu

8542.39.00.01

Output Polarity

COMPLEMENTARY

Number Of Terminals

8

Tepe Reflow Sıcaklığı (°C)

260

Package Description

2.30 MM WIDTH, PLASTIC, MO-187, SOT765-1, VSSOP-8

Ihs Manufacturer

NXP SEMICONDUCTORS

Operating Temperaturemin

-40 °C

Propagation Delay Tpd

13.4 ns

Supply Voltagemin Vsup

1.65 V

Part Life Cycle Code

Transferred

REACH Uyumluluk Kodu

compliant

Max Frequencynomsup

175000000 Hz

Uzunluk

2.3 mm

Jesd30 Code

R-PDSO-G8

Part Package Code

TSSOP

Kurşunsuz Kodu

Yes

Supply Voltagenom Vsup

1.8 V

Terminal Formu

GULL WING