74LVC1G66GW

Specifications

Seated Heightmax

1.1 mm

JESD-609 Kodu

e3

Qualification Status

Not Qualified

Tepe Reflow Sıcaklığı (°C)

260

Operating Temperaturemax

125 °C

Package Style

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Output Characteristics

3-STATE

Logic Ic Type

BUS DRIVER

Normal Position

NO

Gross Weight

12.95

Yüzey Montaj

YES

Clamp Type

2P

Onstate Resistancemax Ron

100 Ω

Uzunluk

2.05 mm

Supply Voltagenom Vsup

2.7 V

Mounting Diameter

16 mm

Terminal Pozisyonu

DUAL

Package Equivalence Code

TSSOP5/6,.08

Fonksiyon Sayısı

1

Package Code

TSSOP

Ihs Manufacturer

NXP SEMICONDUCTORS

Package Description

1.25 MM, PLASTIC, MO-203, SOT-353-1, SC-88A, TSSOP-5

Propagation Delay Tpd

3 ns

Tepe Reflow Süresi (maks. sn)

30

Saturation Current

1

Teral Type

flexible leadsmin

Rohs Code

Yes

Terminal Kaplaması

Tin (Sn)

Number Of Ports

2

Package Shape

RECTANGULAR

Pin Sayısı

5

Output Polarity

TRUE

Number Of Terminals

5

HTS Kodu

8542.39.00.01

Nominal Voltage

12-24 V

Genişlik

1.25 mm

Transport Packaging Sizequantity

62*27.5*28/200

Family

LVC/LCX/Z

Package Body Material

PLASTIC/EPOXY

Analog Ic Other Type

SPST