74LVC1G3157GW

Specifications

Seated Heightmax

1 mm

JESD-609 Kodu

e3

Qualification Status

Not Qualified

Tepe Reflow Sıcaklığı (°C)

260

Operating Temperaturemax

125 °C

Signal Currentmax

0.05 A

Package Style

SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH

Switchoff Timemax

5 ns

Gross Weight

700 g

Offstate Isolationnom

42 dB

Onstate Resistancemax Ron

38 Ω

Yüzey Montaj

YES

Uzunluk

20mm

Supply Currentmax Isup

0.04 mA

Supply Voltagenom Vsup

2.7 V

Package Equivalence Code

TSSOP6,.08

Çap

46mm

Terminal Pozisyonu

DUAL

Fonksiyon Sayısı

1

Package Code

VSSOP

Material

aluminium

Package Description

PLASTIC, SC-88, SOT-363, 6 PIN

Ihs Manufacturer

NXP SEMICONDUCTORS

Number Of Channels

2

Tepe Reflow Süresi (maks. sn)

30

Saturation Current

1

Rohs Code

Yes

Colour

aluminium

Terminal Kaplaması

Tin (Sn)

Pin Sayısı

6

Package Shape

RECTANGULAR

Heatsink Shape

round

Number Of Terminals

6

HTS Kodu

8542.39.00.01

Material Finishing

raw

Genişlik

1.25 mm

Analog Ic Other Type

SINGLE-ENDED MULTIPLEXER

Package Body Material

PLASTIC/EPOXY

Switching

BREAK-BEFORE-MAKE

Internal Diameter

30mm