2N7002BKS

Specifications

Package Shape

RECTANGULAR

Operating Temperaturemin

-55 °C

Tepe Reflow Süresi (maks. sn)

NOT SPECIFIED

Transistor Application

SWITCHING

Operating Mode

ENHANCEMENT MODE

Additional Feature

ESD PROTECTION, LOGIC LEVEL COMPATIBLE

Purpose

cooling of semiconductor devices

Drain Currentmax Id

0.3 A

Terminal Formu

GULL WING

Gross Weight

19.64

Package Style

SMALL OUTLINE

Part Life Cycle Code

Transferred

Rohs Code

Yes

REACH Uyumluluk Kodu

unknown

Terminal Kaplaması

Tin (Sn)

Package Description

PLASTIC, SC-88, 6 PIN

Drainsource On Resistancemax

1.6 Ω

Ds Breakdown Voltagemin

60 V

Yükseklik

20 mm

JESD-609 Kodu

e3

Fet Technology

METAL-OXIDE SEMICONDUCTOR

Number Of Elements

2

Part Package Code

SC-88

ECCN Kodu

EAR99

Weight

0.66 kg/m

Tip

air cooler, blackened

Package Body Material

PLASTIC/EPOXY

Transistor Element Material

SILICON

Pin Sayısı

6

Reference Standard

AEC-Q101

Transport Packaging Sizequantity

48*35*17/800

Related Productsmaterials

thermal paste KPT-8 10g (Art. 85600); substrate 2A1813 (Art. 82860)

Yüzey Montaj

YES

Tepe Reflow Sıcaklığı (°C)

NOT SPECIFIED

Configuration

SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE

Number Of Terminals

6

Depth

30 mm

Moisture Sensitivity Levels

1

Polaritychannel Type

N-CHANNEL

Qualification Status

Not Qualified