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Same-day dispatch from stock
Genuine parts
Verified sourcing
RoHS
Compliant
Support
Technical team support
Specifications
- Tepe Reflow Sıcaklığı (°C)
- 260
- JESD-609 Kodu
- e3
- Package Description
- ULTRA SMALL, PLASTIC, SC-79, 2 PIN
- Number Of Elements
- 1
- Package Style
- SMALL OUTLINE
- Yükseklik
- 18mm
- Number Of Phases
- 1
- Forward Voltagemax Vf
- 0.22 V
- Nonrep Pk Forward Currentmax
- 1 A
- Genişlik
- 12mm
- Tepe Reflow Süresi (maks. sn)
- 30
- Plate Thickness
- 3.6mm
- Rep Pk Reverse Voltagemax
- 40 V
- Type Of Heatsink
- extruded
- Package Body Material
- PLASTIC/EPOXY
- Jesd30 Code
- R-PDSO-F2
- Risk Rank
- 1.16
- Terminal Kaplaması
- Tin (Sn)
- Operating Temperaturemax
- 150 °C
- Terminal Formu
- FLAT
- Material Finishing
- raw
- Material
- aluminium
- Package Shape
- RECTANGULAR
- Üretici Parça No
- 1PS79SB30
- Exterior Housing Material
- 1
- REACH Uyumluluk Kodu
- compliant
- Qualification Status
- Not Qualified
- Ihs Manufacturer
- NXP SEMICONDUCTORS
- Configuration
- SINGLE
- Diode Type
- RECTIFIER DIODE
- Diode Element Material
- SILICON
- Yüzey Montaj
- YES
- Output Currentmax
- 0.2 A
- 2nd Connector Number Of Positions Loaded
- universal
- Gross Weight
- 700 g
- Terminal Pozisyonu
- DUAL
- Reflow Temperaturemax S
- 30
- Saturation Current
- 1
- Kurşunsuz Kodu
- Yes
- Mounting
- for back plate