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C3 ChipZentronix

NXP

BC846S/DG/B2115

Arrays BJT Transistors

RoHS: Compliant

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Compliant

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Specifications

Overall Contact Length
0.440 (11.18mm)
Insulation Materials
Liquid Crystal Polymer (LCP)
Insulation Color
Black
Pitch Mating
0.100 (2.54mm)
Connector Type
Header, Breakaway
Contact Materials
Copper Alloy
Seri
AMPMODU Mod II
Sıra Sayısı
1
Style
Board to Board or Cable
Contact Length Post
0.120 (3.05mm)
Contact Finish Thickness Post
100.0µin (2.54µm)
Fastening Type
Push-Pull
Contact Shape
Square
Pozisyon Sayısı
15
Montaj Tipi
Through Hole
Contact Finish Thickness Mating
15.0µin (0.38µm)
Contact Finish Post
Tin
Contact Lengthmating
0.230 (5.84mm)
Terminal
Solder
Number Of Positions Loaded
All
Contact Type
Male Pin
Akım Değeri
3A
Çalışma Sıcaklığı
-65°C ~ 105°C
Contact Finish Mating
Gold
Ambalaj
Bulk
Material Flammability Rating
UL94 V-0
Shrouding
Unshrouded
Parça Durumu
Active
Insulation Height
0.090 (2.29mm)

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