
Request a quote for pricing
Priced by quantity and lead time.
Shipping
Same-day dispatch from stock
Genuine parts
Verified sourcing
RoHS
Compliant
Support
Technical team support
Specifications
- JESD-609 Kodu
- e0
- Boot Block
- TOP
- Package Code
- TBGA
- Package Equivalence Code
- BGA64,8X8,40
- Parallelserial
- PARALLEL
- Package Description
- BGA-64
- Package Shape
- RECTANGULAR
- Fonksiyon Sayısı
- 1
- Pin Sayısı
- 64
- Operating Temperaturemin
- -40 °C
- Number Of Sectorssize
- 4,255
- Tip
- NOR TYPE
- Toggle Bit
- NO
- Programming Voltage
- 2.7 V
- Common Flash Interface
- YES
- Standby Currentmax
- 0.00021 A
- Operating Mode
- SYNCHRONOUS
- Operating Temperaturemax
- 85 °C
- Package Style
- GRID ARRAY, THIN PROFILE
- Additional Feature
- ASYNCHRONOUS READ MODE
- Access Timemax
- 95 ns
- Terminal Formu
- BALL
- Kurşunsuz Kodu
- No
- Temperature Grade
- INDUSTRIAL
- Supply Voltagemax Vsup
- 3.6 V
- Rohs Code
- No
- Yüzey Montaj
- YES
- Supply Currentmax
- 0.031 mA
- Number Of Words
- 16777216 words
- REACH Uyumluluk Kodu
- unknown
- Memory Density
- 268435456 bit
- Number Of Words Code
- 16000000
- Qualification Status
- Not Qualified
- Package Body Material
- PLASTIC/EPOXY
- Part Package Code
- BGA
- Uzunluk
- 13 mm
- Data Polling
- NO
- Supply Voltagemin Vsup
- 2.3 V
- Supply Voltagenom Vsup
- 3 V
- Terminal Pozisyonu
- BOTTOM
Related Products
HARTING
09806150100
Memory Modules
Advantech
14S6100010
Memory Modules
TE Connectivity
2-965363-1
Memory Modules
TE Connectivity
2-968358-1
Memory Modules
Microchip Technology
2284700-R
Memory Modules
Microchip Technology
25CS640-H/SN
Memory Modules
Microchip Technology
25CS640T-E/Q4B
Memory Modules
Microchip Technology
25CS640T-H/SN
Memory Modules

