NAND99W3M1BZBC5E

Specifications

Tepe Reflow Süresi (maks. sn)

NOT SPECIFIED

Supply Voltagenom Vsup

3 V

Mixed Memory Type

FLASH+SDRAM

Qualification Status

Not Qualified

Package Code

FBGA

REACH Uyumluluk Kodu

unknown

Part Life Cycle Code

Obsolete

Package Equivalence Code

BGA137,10X15,32

Jesd30 Code

R-PBGA-B137

Package Style

GRID ARRAY

Kurşunsuz Kodu

Yes

Terminal Adımı

0.8 mm

Package Shape

RECTANGULAR

Terminal Pozisyonu

BOTTOM

Number Of Terminals

137

Operating Temperaturemin

-30 °C

Operating Temperaturemax

85 °C

Terminal Formu

BALL

HTS Kodu

8542.32.00.71

Yüzey Montaj

YES

ECCN Kodu

EAR99

Memory Ic Type

MEMORY CIRCUIT

Part Package Code

BGA

Rohs Code

Yes

Package Body Material

PLASTIC/EPOXY

Pin Sayısı

137

Package Description

FBGA, BGA137,10X15,32

Temperature Grade

OTHER

Ihs Manufacturer

NUMONYX

Tepe Reflow Sıcaklığı (°C)

NOT SPECIFIED