NAND02GW3B2DZA6F

Specifications

Number Of Words Code

256000000

Command User Interface

YES

Terminal Adımı

0.8 mm

Package Shape

RECTANGULAR

Number Of Sectorssize

2K

Seated Heightmax

1.05 mm

Readybusy

YES

Access Timemax

25000 ns

Memory Width

8

Package Code

TFBGA

Qualification Status

Not Qualified

REACH Uyumluluk Kodu

unknown

Supply Voltagemin Vsup

2.7 V

Uzunluk

12 mm

Programming Voltage

3 V

Package Style

GRID ARRAY, THIN PROFILE, FINE PITCH

Memory Density

2147483648 bit

Supply Voltagemax Vsup

3.6 V

Package Body Material

PLASTIC/EPOXY

Package Description

TFBGA, BGA63,10X12,32

Rohs Code

Yes

Operating Temperaturemax

85 °C

Terminal Formu

BALL

Number Of Terminals

63

Standby Currentmax

0.00005 A

Organization

256MX8

Tip

SLC NAND TYPE

Yüzey Montaj

YES

ECCN Kodu

EAR99

Data Polling

NO

Page Size

2K words

Terminal Pozisyonu

BOTTOM

Genişlik

9.5 mm

Number Of Words

268435456 words

Toggle Bit

NO

Tepe Reflow Süresi (maks. sn)

NOT SPECIFIED

Supply Voltagenom Vsup

3 V

Fonksiyon Sayısı

1

Supply Currentmax

0.03 mA

Part Life Cycle Code

Transferred