MC-222253AF9-B85X-BT3

Specifications

Memory Width

16

Organization

2MX16

Additional Feature

SRAM IS ORGANISED AS 256 X 16 OR 512K X 8 AND FLASH CAN ALSO BE ORGANISED AS 4M X 8

Package Shape

RECTANGULAR

REACH Uyumluluk Kodu

compliant

Ihs Manufacturer

NEC ELECTRONICS AMERICA INC

Supply Voltagemax Vsup

3.6 V

JESD-609 Kodu

e0

Number Of Terminals

77

Yüzey Montaj

YES

Terminal Adımı

0.8 mm

Terminal Kaplaması

TIN LEAD

Operating Temperaturemax

85 °C

Package Code

TFBGA

Number Of Words Code

2000000

Terminal Formu

BALL

Memory Ic Type

MEMORY CIRCUIT

HTS Kodu

8542.32.00.71

Package Description

12 X 7 MM, FBGA-77

Fonksiyon Sayısı

1

Part Life Cycle Code

Obsolete

Seated Heightmax

1.2 mm

Memory Density

33554432 bit

Package Body Material

PLASTIC/EPOXY

Supply Voltagemin Vsup

2.7 V

Temperature Grade

OTHER

Package Style

GRID ARRAY, THIN PROFILE, FINE PITCH

Genişlik

7 mm

Operating Mode

ASYNCHRONOUS

ECCN Kodu

EAR99

Terminal Pozisyonu

BOTTOM

Rohs Code

No

Uzunluk

12 mm

Jesd30 Code

R-PBGA-B77

Qualification Status

Not Qualified

Number Of Words

2097152 words

Operating Temperaturemin

-25 °C