LMV228TLX

Specifications

Package Code

VFBGA

Yüzey Montaj

YES

Temperature Grade

INDUSTRIAL

Rohs Code

No

JESD-609 Kodu

e0

Tepe Reflow Sıcaklığı (°C)

260

REACH Uyumluluk Kodu

not_compliant

Package Body Material

PLASTIC/EPOXY

Qualification Status

Not Qualified

Package Description

1 X 1 MM, 0.60 MM HEIGHT, LEAD FREE, MO-211BA, MICRO SMD-4

Operating Temperaturemin

-40 °C

Fonksiyon Sayısı

1

Saturation Current

1

Uzunluk

1.014 mm

Package Shape

SQUARE

Telecom Ic Type

RF AND BASEBAND CIRCUIT

Terminal Pozisyonu

BOTTOM

Package Style

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Operating Temperaturemax

85 °C

Part Life Cycle Code

Transferred

Ihs Manufacturer

NATIONAL SEMICONDUCTOR CORP

Jesd30 Code

S-PBGA-B4

Number Of Terminals

4

Supply Voltagenom

2.7 V

Seated Heightmax

0.675 mm

Terminal Kaplaması

Tin/Lead (Sn63Pb37)

HTS Kodu

8542.39.00.01

Genişlik

1.014 mm

Terminal Formu

BALL

Tepe Reflow Süresi (maks. sn)

40

Terminal Adımı

0.5 mm