MC9328MXLDVH20

Specifications

Operating Temperaturemax

70 °C

Part Package Code

BGA

Package Shape

SQUARE

Yüzey Montaj

YES

Qualification Status

Not Qualified

Terminal Kaplaması

Tin/Lead/Silver (Sn/Pb/Ag)

Tepe Reflow Sıcaklığı (°C)

220

Package Style

GRID ARRAY, LOW PROFILE, FINE PITCH

HTS Kodu

8542.31.00.01

Uzunluk

14 mm

Package Description

LFBGA, BGA256,16X16,32

External Data Bus Width

32

Clock Frequencymax

16 MHz

Pin Sayısı

256

Package Code

LFBGA

Supply Voltagemin

1.8 V

Format

FIXED POINT

Address Bus Width

25

Upsucsperipheral Ics Type

MICROPROCESSOR, RISC

Temperature Grade

OTHER

Jesd30 Code

S-PBGA-B256

Rohs Code

No

Ihs Manufacturer

MOTOROLA INC

Boundary Scan

YES

Speed

200 MHz

Supply Voltagemax

2 V

Bit Size

32

REACH Uyumluluk Kodu

unknown

Integrated Cache

YES

Number Of Terminals

256

Package Equivalence Code

BGA256,16X16,32

Terminal Formu

BALL

Genişlik

14 mm

Tepe Reflow Süresi (maks. sn)

30

Terminal Pozisyonu

BOTTOM

Seated Heightmax

1.6 mm

Supply Voltagenom

1.9 V

Part Life Cycle Code

Transferred

JESD-609 Kodu

e0

Terminal Adımı

0.8 mm