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Priced by quantity and lead time.
Shipping
Same-day dispatch from stock
Genuine parts
Verified sourcing
RoHS
Compliant
Support
Technical team support
Specifications
- Ihs Manufacturer
- MOTOROLA INC
- Yüzey Montaj
- YES
- Tepe Reflow Sıcaklığı (°C)
- NOT SPECIFIED
- Integrated Cache
- YES
- REACH Uyumluluk Kodu
- unknown
- Package Description
- LBGA, BGA352,26X26,50
- Low Power Mode
- YES
- Terminal Pozisyonu
- BOTTOM
- Package Equivalence Code
- BGA352,26X26,50
- Üretici Parça No
- XPC8245TZU300B
- JESD-609 Kodu
- e0
- Technology
- CMOS
- Clock Frequencymax
- 66 MHz
- Terminal Kaplaması
- Tin/Lead (Sn/Pb)
- Package Code
- LBGA
- Supply Voltagemax
- 1.9 V
- Part Life Cycle Code
- Transferred
- Moisture Sensitivity Levels
- 3
- Format
- FLOATING POINT
- Supply Voltagemin
- 1.7 V
- Terminal Adımı
- 1.27 mm
- Jesd30 Code
- S-PBGA-B352
- ECCN Kodu
- 3A001.A.3
- Additional Feature
- ALSO OPERATES AT 2V SUPPLY
- Risk Rank
- 8.7
- Package Shape
- SQUARE
- Reflow Temperaturemax S
- NOT SPECIFIED
- Seated Heightmax
- 1.65 mm
- Upsucsperipheral Ics Type
- MICROPROCESSOR, RISC
- Terminal Formu
- BALL
- Package Style
- GRID ARRAY, LOW PROFILE
- Package Body Material
- PLASTIC/EPOXY
- RoHS
- Non-Compliant
- Speed
- 300 MHz
- Number Of Terminals
- 352
- Boundary Scan
- YES
- Bit Size
- 32
- Address Bus Width
- 32
- Genişlik
- 35 mm
- Power Supplies
- 2,3.3 V