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C3 ChipZentronix
5019314070

Molex

5019314070

IC and Component Sockets

In StockRoHS: Compliant

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Same-day dispatch from stock

Genuine parts

Verified sourcing

RoHS

Compliant

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Technical team support

Specifications

Applications
General Purpose
Contact Finish Thickness Mating
3.90μin 0.099μm
Contact Finish Mating
Gold
RoHS Durumu
ROHS3 Compliant
Insulation Resistance
100000000Ohm
Insulation Materials
Polyamide (PA), Nylon
Reliability
COMMERCIAL
Mating Contact Pitch
0.049 inch
Sıra Sayısı
2
Fastening Type
Detent Lock
Terminal
Solder
Mounting Option1
LOCKING
Contact Materials
Copper Alloy
Nem Hassasiyeti (MSL)
1 (Unlimited)
Reference Standard
UL
Yayın Yılı
2012
Insulation Height
0.346 8.80mm
Özellikler
Pick and Place, Solder Retention
Seri
Duo-Clasp 501931
Number Of Pcb Rows
2
Çalışma Sıcaklığı
-25°C~85°C
Contact Finish Thickness Post
39.4μin 1.00μm
Fabrika Tedarik Süresi
12 Weeks
Nominal Gerilim
50V
Material Flammability Rating
UL94 V-0
Current Rating Amps
1A
Parça Durumu
Active
Ambalaj
Tape & Reel (TR)
Montaj Tipi
Surface Mount
Style
Board to Cable/Wire
Total Number Of Contacts
40
Body Depth
0.346 inch
Body Length Or Diameter
1.161 inch
Pitch Mating
0.049 1.25mm
Contact Type
Forked
Body Breadth
0.346 inch
Plating Thickness
3.93μin
Contact Finish Post
Tin
Number Of Positions Loaded
All
Number Of Conductors
ONE

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