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C3 ChipZentronix

Micross Components

AS8F512K32P-150

Memory Modules

RoHS: Compliant

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Specifications

Memory Ic Type
FLASH MODULE
Uzunluk
29.718 mm
Part Life Cycle Code
Active
Standby Currentmax
0.0065 A
Tepe Reflow Süresi (maks. sn)
NOT SPECIFIED
Supply Currentmax
0.24 mA
Number Of Words Code
512000
Access Timemax
150 ns
Ihs Manufacturer
MICROSS COMPONENTS
Supply Voltagemax Vsup
5.5 V
Toggle Bit
YES
Qualification Status
Not Qualified
Package Description
PGA, PGA66,11X11
ECCN Kodu
3A001.A.2.C
Sector Size
16K
Package Equivalence Code
PGA66,11X11
Organization
512KX32
Package Body Material
CERAMIC, METAL-SEALED COFIRED
Jesd30 Code
S-CPGA-P66
Genişlik
29.718 mm
Fonksiyon Sayısı
1
Screening Level
MIL-STD-883
Terminal Pozisyonu
PERPENDICULAR
HTS Kodu
8542.32.00.51
Terminal Adımı
2.54 mm
Operating Temperaturemin
-55 °C
Package Style
GRID ARRAY
Number Of Sectorssize
32
Memory Density
16777216 bit
Tepe Reflow Sıcaklığı (°C)
NOT SPECIFIED
Number Of Terminals
66
Data Polling
YES
Yüzey Montaj
NO
Supply Voltagemin Vsup
4.5 V
Supply Voltagenom Vsup
5 V
Memory Width
32
Package Code
PGA
Package Shape
SQUARE
Operating Temperaturemax
125 °C
Alternate Memory Width
16

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