Shipping
Same-day dispatch from stock
Genuine parts
Verified sourcing
RoHS
Compliant
Support
Technical team support
Specifications
- Operating Temperaturemin
- -40 °C
- Tepe Reflow Süresi (maks. sn)
- NOT SPECIFIED
- Package Body Material
- PLASTIC/EPOXY
- Supply Voltagenom
- 1.8 V
- Telecom Ic Type
- LAN SWITCHING CIRCUIT
- Package Code
- LBGA
- Qualification Status
- Not Qualified
- Part Package Code
- BGA
- Yüzey Montaj
- YES
- Operating Temperaturemax
- 85 °C
- Ihs Manufacturer
- ZARLINK SEMICONDUCTOR INC
- Pin Sayısı
- 208
- Kurşunsuz Kodu
- No
- Seated Heightmax
- 1.4 mm
- Number Of Terminals
- 208
- Rohs Code
- No
- Tepe Reflow Sıcaklığı (°C)
- NOT SPECIFIED
- Jesd30 Code
- S-PBGA-B208
- JESD-609 Kodu
- e0
- Fonksiyon Sayısı
- 1
- Terminal Adımı
- 1 mm
- Part Life Cycle Code
- Transferred
- Genişlik
- 17 mm
- Uzunluk
- 17 mm
- Temperature Grade
- INDUSTRIAL
- Terminal Formu
- BALL
- Package Style
- GRID ARRAY, LOW PROFILE
- Package Description
- LBGA,
- REACH Uyumluluk Kodu
- compliant
- HTS Kodu
- 8542.39.00.01
- Package Shape
- SQUARE
- Terminal Kaplaması
- TIN LEAD
- Terminal Pozisyonu
- BOTTOM
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