Shipping
Same-day dispatch from stock
Genuine parts
Verified sourcing
RoHS
Compliant
Support
Technical team support
Specifications
- Çalışma Sıcaklığı
- -40°C~85°C
- Tepe Reflow Sıcaklığı (°C)
- 225
- Genişlik
- 23mm
- Terminal Formu
- BALL
- Yüzey Montaj
- YES
- Besleme Gerilimi
- 1.8V
- Uzunluk
- 23mm
- Terminal Sayısı
- 324
- Besleme Gerilimi
- 1.65V~1.95V
- Function
- Telecom Circuit
- JESD-609 Kodu
- e0
- Number Of Circuits
- 1
- Terminal Kaplaması
- TIN LEAD
- Terminal Pozisyonu
- BOTTOM
- Interface
- TDM
- Ambalaj
- Tray
- Kurşunsuz Kodu
- no
- Qualification Status
- Not Qualified
- Jesd30 Code
- S-PBGA-B324
- Parça Durumu
- Obsolete
- Nem Hassasiyeti (MSL)
- 3 (168 Hours)
- Tepe Reflow Süresi (maks. sn)
- 30
- Current Supply
- 950mA
- Temel Parça No
- ZL50119
- Kılıf / Paket
- 324-BGA
- Montaj Tipi
- Surface Mount
- RoHS Durumu
- Non-RoHS Compliant
Related Products
In Stock
Microchip
10GBASEKR_PHY-OMFL
Telecom Interface ICs
In Stock
Tripp Lite
116750225-001
Telecom Interface ICs
In Stock
STMicroelectronics
132864
Telecom Interface ICs
In Stock
Renesas
14230R-1500
Telecom Interface ICs
In Stock
Renesas
14235R-2000
Telecom Interface ICs
In Stock
Renesas
14235R-500
Telecom Interface ICs
In Stock
Renesas
14305R-2000
Telecom Interface ICs
In Stock
Renesas
14305R-500
Telecom Interface ICs