Shipping
Same-day dispatch from stock
Genuine parts
Verified sourcing
RoHS
Compliant
Support
Technical team support
Specifications
- Temel Ürün No
- M2S150
- Tedarikçi Cihaz Paketi
- 484-FBGA (19x19)
- Tepe Reflow Süresi (maks. sn)
- NOT SPECIFIED
- Fabrika Paket Adedi
- 84
- Ambalaj
- Tray
- Package Body Material
- PLASTIC/EPOXY
- Nem Hassasiyeti (MSL)
- 3 (168 Hours)
- Ürün Durumu
- Active
- RoHS Durumu
- Non-RoHS Compliant
- Risk Rank
- 5.81
- Operating Temperaturemax
- 85 °C
- Seri
- SmartFusion®2
- Terminal Sayısı
- 484
- Moisture Sensitive
- Yes
- Ram Size
- 64KB
- Tepe Reflow Sıcaklığı (°C)
- NOT SPECIFIED
- Reflow Temperaturemax S
- 40
- Supply Voltagemax
- 1.26 V
- Seated Heightmax
- 3.15 mm
- JESD-609 Kodu
- e3
- Lifecycle Status
- IN PRODUCTION (Last Updated: 1 month ago)
- Terminal Adımı
- 0.8mm
- Number Of Logic Elements
- 146124 LE
- Fabrika Tedarik Süresi
- 10 Weeks
- Terminal Formu
- BALL
- Temperature Grade
- OTHER
- Package Style
- GRID ARRAY, FINE PITCH
- Part Life Cycle Code
- Active
- Number Of Cores
- 1 Core
- Core Processor
- ARM® Cortex®-M3
- Üretici Parça No
- M2S150TS-1FCVG484
- Package Shape
- SQUARE
- Terminal Kaplaması
- MATTE TIN
- REACH Uyumluluk Kodu
- compliant
- Connectivity
- CANbus, Ethernet, I2C, SPI, UART/USART, USB
- Speed
- 166MHz
- Package Code
- FBGA
- Architecture
- MCU, FPGA
- Yüzey Montaj
- YES
- Maximum Clock Frequency
- 166 MHz