Shipping
Same-day dispatch from stock
Genuine parts
Verified sourcing
RoHS
Compliant
Support
Technical team support
Specifications
- Seated Heightmax
- 2.9 mm
- Supply Voltagemax
- 1.26 V
- Tepe Reflow Sıcaklığı (°C)
- NOT SPECIFIED
- Boyut / Ölçü
- 0.094 Dia x 0.250 L (2.39mm x 6.35mm)
- Reflow Temperaturemax S
- 30
- Ram Size
- 64KB
- Seri
- SmartFusion®2
- Terminal Sayısı
- 2
- Operating Temperaturemax
- 125 °C
- Özellikler
- Military, Moisture Resistant, Weldable
- Ürün Durumu
- Active
- RoHS Durumu
- Non-RoHS Compliant
- Risk Rank
- 5.84
- Nem Hassasiyeti (MSL)
- 3 (168 Hours)
- Package Body Material
- PLASTIC/EPOXY
- Ambalaj
- Tray
- Tepe Reflow Süresi (maks. sn)
- NOT SPECIFIED
- Tedarikçi Cihaz Paketi
- Axial
- Temel Ürün No
- RNC55
- Operating Temperaturemin
- -55 °C
- Number Of Inputs
- 574
- Connectivity
- CANbus, Ethernet, I2C, SPI, UART/USART, USB
- REACH Uyumluluk Kodu
- not_compliant
- Package Shape
- SQUARE
- Temperature Coefficient
- ±25ppm/°C
- Terminal Kaplaması
- Tin/Lead (Sn/Pb)
- Technology
- CMOS
- Üretici Parça No
- M2S150TS-1FC1152M
- Core Processor
- ARM® Cortex®-M3
- Part Life Cycle Code
- Active
- Temperature Grade
- MILITARY
- Terminal Formu
- BALL
- Package Style
- GRID ARRAY
- Terminal Adımı
- 1mm
- Number Of Logic Cells
- 146124
- Number Of Outputs
- 574
- Güç (Watt)
- 0.125W, 1/8W
- JESD-609 Kodu
- e0
- Lifecycle Status
- IN PRODUCTION (Last Updated: 1 month ago)
- Programmable Logic Type
- FIELD PROGRAMMABLE GATE ARRAY