Shipping
Same-day dispatch from stock
Genuine parts
Verified sourcing
RoHS
Compliant
Support
Technical team support
Specifications
- Architecture
- MCU, FPGA
- Ürün Durumu
- Active
- Package Code
- BGA
- RoHS Durumu
- RoHS Compliant
- Operating Temperaturemax
- 85 °C
- Parça Durumu
- Active
- Supply Voltagenom
- 1.2 V
- Package Body Material
- PLASTIC/EPOXY
- Supply Voltagemax Vsup
- 1.26V
- Tepe Reflow Süresi (maks. sn)
- NOT SPECIFIED
- Speed
- 166MHz
- Connectivity
- CANbus, Ethernet, I2C, SPI, UART/USART, USB
- Seri
- SmartFusion®2
- HTS Kodu
- 8542.39.00.01
- Ambalaj
- Tray
- Terminal Pozisyonu
- BOTTOM
- Number Of Logic Cells
- 146124
- Paket
- Tray
- Package Style
- GRID ARRAY
- Reflow Temperaturemax S
- 40
- Program Memory Size
- 512 kB
- Supply Voltagemin Vsup
- 1.14V
- Yüzey Montaj
- YES
- Üretici Parça No
- M2S150-1FCSG536
- Number Of Cores
- 1 Core
- Package Description
- FBGA-536
- Tedarikçi Cihaz Paketi
- 536-CSPBGA (16x16)
- Kılıf / Paket
- 536-LFBGA, CSPBGA
- Number Of Terminals
- 536
- Number Of Outputs
- 293
- Supply Voltagemin
- 1.14 V
- Primary Attributes
- FPGA - 150K Logic Modules
- Lifecycle Status
- IN PRODUCTION (Last Updated: 3 weeks ago)
- Number Of Ios
- 293
- Flash Size
- 512KB
- Ihs Manufacturer
- MICROSEMI CORP
- Core Processor
- ARM® Cortex®-M3
- Power Supplies
- 1.2V
- Risk Rank
- 5.77
- Terminal Sayısı
- 536