Shipping
Same-day dispatch from stock
Genuine parts
Verified sourcing
RoHS
Compliant
Support
Technical team support
Specifications
- Yüzey Montaj
- YES
- Supply Voltagemin Vsup
- 1.14V
- Reflow Temperaturemax S
- 30
- Program Memory Size
- 512 kB
- Package Style
- GRID ARRAY
- Tedarikçi Cihaz Paketi
- 676-FBGA (27x27)
- Kılıf / Paket
- 676-BGA
- Number Of Terminals
- 676
- Package Description
- FBGA-676
- Number Of Cores
- 1 Core
- Üretici Parça No
- M2S090TS-FG676
- Primary Attributes
- FPGA - 90K Logic Modules
- Number Of Outputs
- 425
- Supply Voltagemin
- 1.14 V
- Flash Size
- 512KB
- Lifecycle Status
- IN PRODUCTION (Last Updated: 3 weeks ago)
- Number Of Ios
- 425
- RoHS Durumu
- Non-RoHS Compliant
- Operating Temperaturemax
- 85 °C
- Parça Durumu
- Active
- Package Code
- BGA
- Architecture
- MCU, FPGA
- Ürün Durumu
- Active
- Package Body Material
- PLASTIC/EPOXY
- Supply Voltagenom
- 1.2 V
- Terminal Adımı
- 1mm
- RoHS
- N
- Tepe Reflow Süresi (maks. sn)
- NOT SPECIFIED
- Speed
- 166MHz
- Supply Voltagemax Vsup
- 1.26V
- Paket
- Tray
- Number Of Logic Cells
- 86316
- Terminal Pozisyonu
- BOTTOM
- Ambalaj
- Tray
- HTS Kodu
- 8542.39.00.01
- Connectivity
- CANbus, Ethernet, I2C, SPI, UART/USART, USB
- Seri
- SmartFusion®2
- Programmable Logic Type
- FIELD PROGRAMMABLE GATE ARRAY
- Peripherals
- DDR, PCIe, SERDES
- Moisture Sensitivity Levels
- 3