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M2S090TS-1FCSG325

Microsemi Corporation

M2S090TS-1FCSG325

SoC

RoHS: Compliant

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Specifications

Program Memory Size
512 kB
Yüzey Montaj
YES
Supply Voltagemin Vsup
1.14V
Package Style
GRID ARRAY, THIN PROFILE, FINE PITCH
Number Of Terminals
325
Kılıf / Paket
325-TFBGA, CSPBGA
Tedarikçi Cihaz Paketi
325-FCBGA (11x13.5)
Package Description
FBGA-325
Number Of Cores
1 Core
Üretici Parça No
M2S090TS-1FCSG325
Primary Attributes
FPGA - 90K Logic Modules
Supply Voltagemin
1.14 V
Number Of Outputs
180
Flash Size
512KB
Number Of Ios
180
Lifecycle Status
IN PRODUCTION (Last Updated: 3 weeks ago)
Operating Temperaturemax
85 °C
Parça Durumu
Active
RoHS Durumu
RoHS Compliant
Architecture
MCU, FPGA
Ürün Durumu
Active
Package Code
TFBGA
Package Body Material
PLASTIC/EPOXY
Montaj Stili
SMD/SMT
Terminal Adımı
0.5mm
Supply Voltagenom
1.2 V
Speed
166MHz
RoHS
Details
Tepe Reflow Süresi (maks. sn)
NOT SPECIFIED
Supply Voltagemax Vsup
1.26V
Paket
Tray
Number Of Logic Cells
86316
Terminal Pozisyonu
BOTTOM
Ambalaj
Tray
Connectivity
CANbus, Ethernet, I2C, SPI, UART/USART, USB
Seri
SmartFusion®2
HTS Kodu
8542.39.00.01
Number Of Logic Array Blocks Labs
7193 LAB
Supply Voltagemax
1.26 V
Temperature Grade
OTHER

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