Shipping
Same-day dispatch from stock
Genuine parts
Verified sourcing
RoHS
Compliant
Support
Technical team support
Specifications
- Jesd30 Code
- S-PBGA-B676
- Uzunluk
- 27mm
- Data Ram Size
- 64 kB
- Number Of Logic Elements
- 86316 LE
- Nem Hassasiyeti (MSL)
- 3 (168 Hours)
- Risk Rank
- 5.27
- Frekans
- 166MHz
- Terminal Sayısı
- 676
- Ihs Manufacturer
- MICROSEMI CORP
- Core Processor
- ARM® Cortex®-M3
- Power Supplies
- 1.2V
- Ram Size
- 64KB
- Çalışma Sıcaklığı
- 0°C~85°C TJ
- Maximum Clock Frequency
- 166 MHz
- JESD-609 Kodu
- e0
- REACH Uyumluluk Kodu
- not_compliant
- Fabrika Tedarik Süresi
- 10 Weeks
- Core Architecture
- ARM
- Part Life Cycle Code
- Active
- Interface
- CAN, Ethernet, I2C, SPI, UART, USART, USB
- Package Equivalence Code
- BGA676,26X26,40
- Temel Ürün No
- M2S090
- Rohs Code
- No
- Terminal Formu
- BALL
- Package Shape
- SQUARE
- Mated Stacking Heights
- 22.86mm, 31.9mm
- Supply Voltagemax
- 1.26 V
- Temperature Grade
- OTHER
- Terminal Kaplaması
- Tin/Lead (Sn/Pb)
- Peripherals
- DDR, PCIe, SERDES
- Moisture Sensitivity Levels
- 3
- Programmable Logic Type
- FIELD PROGRAMMABLE GATE ARRAY
- Genişlik
- 27mm
- Yayın Yılı
- 2009
- Seated Heightmax
- 2.44 mm
- Number Of Inputs
- 425
- Technology
- CMOS
- Contact Finish Thickness
- 30.0µin (0.76µm)
- Height Above Board
- 0.892 (22.66mm)
- Tepe Reflow Sıcaklığı (°C)
- NOT SPECIFIED