Shipping
Same-day dispatch from stock
Genuine parts
Verified sourcing
RoHS
Compliant
Support
Technical team support
Specifications
- JESD-609 Kodu
- e0
- REACH Uyumluluk Kodu
- not_compliant
- Ram Size
- 64KB
- Core
- ARM Cortex M3
- Maximum Clock Frequency
- 166 MHz
- Çalışma Sıcaklığı
- 0°C~85°C TJ
- Package Equivalence Code
- BGA676,26X26,40
- Temel Ürün No
- M2S090
- Part Life Cycle Code
- Active
- Interface
- CAN, Ethernet, I2C, SPI, UART, USART, USB
- Terminal Formu
- BALL
- Rohs Code
- No
- Fabrika Tedarik Süresi
- 12 Weeks
- Core Architecture
- ARM
- Number Of Logic Elements
- 86316 LE
- Data Ram Size
- 64 kB
- Nem Hassasiyeti (MSL)
- 3 (168 Hours)
- Uzunluk
- 27mm
- Jesd30 Code
- S-PBGA-B676
- Ihs Manufacturer
- MICROSEMI CORP
- Power Supplies
- 1.2V
- Core Processor
- ARM® Cortex®-M3
- Risk Rank
- 5.83
- Frekans
- 166MHz
- Terminal Sayısı
- 676
- Speed Grade
- STD
- Moisture Sensitive
- Yes
- Technology
- CMOS
- Number Of Inputs
- 425
- Seated Heightmax
- 2.44 mm
- Qualification Status
- Not Qualified
- Besleme Gerilimi
- 1.2V
- Maks. Oturma Yüksekliği
- 2.44mm
- Tepe Reflow Sıcaklığı (°C)
- NOT SPECIFIED
- Package Shape
- SQUARE
- Shipping Restrictions
- This product may require additional documentation to export from the United States.
- Fabrika Paket Adedi
- 40
- Yayın Yılı
- 2009
- Genişlik
- 27mm
- Terminal Kaplaması
- Tin/Lead (Sn/Pb)