Shipping
Same-day dispatch from stock
Genuine parts
Verified sourcing
RoHS
Compliant
Support
Technical team support
Specifications
- Tepe Reflow Sıcaklığı (°C)
- NOT SPECIFIED
- Maks. Oturma Yüksekliği
- 2.44mm
- Qualification Status
- Not Qualified
- Besleme Gerilimi
- 1.2V
- Seated Heightmax
- 2.44 mm
- Number Of Inputs
- 387
- Technology
- CMOS
- Programmable Logic Type
- FIELD PROGRAMMABLE GATE ARRAY
- Moisture Sensitivity Levels
- 3
- Peripherals
- DDR, PCIe, SERDES
- Terminal Kaplaması
- MATTE TIN
- Supply Voltagemax
- 1.26 V
- Yayın Yılı
- 2015
- Genişlik
- 27mm
- Package Shape
- SQUARE
- Fabrika Tedarik Süresi
- 10 Weeks
- Terminal Formu
- BALL
- Rohs Code
- Yes
- Package Equivalence Code
- BGA676,26X26,40
- Temel Ürün No
- M2S060
- Part Life Cycle Code
- Active
- Çalışma Sıcaklığı
- -40°C~100°C TJ
- Ram Size
- 64KB
- REACH Uyumluluk Kodu
- compliant
- JESD-609 Kodu
- e3
- Risk Rank
- 5.81
- Terminal Sayısı
- 676
- Core Processor
- ARM® Cortex®-M3
- Power Supplies
- 1.2V
- Ihs Manufacturer
- MICROSEMI CORP
- Uzunluk
- 27mm
- Jesd30 Code
- S-PBGA-B676
- Nem Hassasiyeti (MSL)
- 3 (168 Hours)
- Primary Attributes
- FPGA - 60K Logic Modules
- Number Of Outputs
- 387
- Supply Voltagemin
- 1.14 V
- Flash Size
- 256KB
- Lifecycle Status
- IN PRODUCTION (Last Updated: 3 weeks ago)
- Number Of Ios
- 387
- Supply Voltagemin Vsup
- 1.14V