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Priced by quantity and lead time.
Shipping
Same-day dispatch from stock
Genuine parts
Verified sourcing
RoHS
Compliant
Support
Technical team support
Specifications
- Reflow Temperaturemax S
- 30
- Program Memory Size
- 256 kB
- Yüzey Montaj
- YES
- Supply Voltagemin Vsup
- 1.14V
- Package Style
- GRID ARRAY, THIN PROFILE, FINE PITCH
- Number Of Terminals
- 325
- Kılıf / Paket
- 325-TFBGA, CSPBGA
- Tedarikçi Cihaz Paketi
- 325-FCBGA (11x11)
- Package Description
- FBGA-325
- Number Of Cores
- 1 Core
- Üretici Parça No
- M2S060-1FCS325I
- Primary Attributes
- FPGA - 60K Logic Modules
- Supply Voltagemin
- 1.14 V
- Number Of Outputs
- 200
- Flash Size
- 256KB
- Number Of Ios
- 200
- Lifecycle Status
- IN PRODUCTION (Last Updated: 2 weeks ago)
- Parça Durumu
- Active
- RoHS Durumu
- Non-RoHS Compliant
- Architecture
- MCU, FPGA
- Ürün Durumu
- Active
- Package Code
- TFBGA
- Package Body Material
- PLASTIC/EPOXY
- Terminal Adımı
- 0.5mm
- Supply Voltagenom
- 1.2 V
- Speed
- 166MHz
- RoHS
- N
- Tepe Reflow Süresi (maks. sn)
- NOT SPECIFIED
- Supply Voltagemax Vsup
- 1.26V
- Paket
- Tray
- Number Of Logic Cells
- 56520
- Terminal Pozisyonu
- BOTTOM
- Ambalaj
- Tray
- Connectivity
- CANbus, Ethernet, I2C, SPI, UART/USART, USB
- Seri
- SmartFusion®2
- HTS Kodu
- 8542.39.00.01
- Number Of Logic Array Blocks Labs
- 4710 LAB
- Supply Voltagemax
- 1.26 V
- Terminal Kaplaması
- Tin/Lead (Sn/Pb)
- Peripherals
- DDR, PCIe, SERDES