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Priced by quantity and lead time.
Shipping
Same-day dispatch from stock
Genuine parts
Verified sourcing
RoHS
Compliant
Support
Technical team support
Specifications
- Package Style
- GRID ARRAY, THIN PROFILE, FINE PITCH
- Contact Materials
- Silver Alloy
- Package Code
- TFBGA
- Number Of Poles Per Deck
- 2
- Yayın Yılı
- 2015
- Number Of Logic Cells
- 56340
- Terminal Pozisyonu
- BOTTOM
- Besleme Gerilimi
- 1.2V
- Ürün Durumu
- Active
- Core Processor
- ARM® Cortex®-M3
- Terminal Sayısı
- 325
- Rohs Code
- No
- Fabrika Tedarik Süresi
- 10 Weeks
- Circuit Per Deck
- DP4T
- Contact Timing
- Non-Shorting (BBM)
- Tepe Reflow Sıcaklığı (°C)
- NOT SPECIFIED
- Supply Voltagemax Vsup
- 1.26V
- Package Description
- FBGA-325
- Data Ram Size
- 64 kB
- Actuator Length
- 11.10mm
- Number Of Cores
- 1 Core
- Tedarikçi Cihaz Paketi
- 325-FCBGA (11x11)
- Terminal Formu
- BALL
- Package Shape
- SQUARE
- Supply Voltagenom
- 1.2 V
- Technology
- CMOS
- Nem Hassasiyeti (MSL)
- 3 (168 Hours)
- Number Of Logic Elements
- 56340 LE
- Connectivity
- CANbus, Ethernet, I2C, SPI, UART/USART, USB
- Kılıf / Paket
- 325-TFBGA, CSPBGA
- Ihs Manufacturer
- MICROSEMI CORP
- HTS Kodu
- 8542.39.00.01
- Flash Size
- 256KB
- Montaj Stili
- SMD/SMT
- Peripherals
- DDR, PCIe, SERDES
- Temperature Grade
- OTHER
- Additional Feature
- LG-MIN, WD-MIN
- Package Equivalence Code
- BGA325,21X21,20
- Üretici Parça No
- M2S050T-1FCS325
- Montaj Tipi
- Panel Mount