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Shipping
Same-day dispatch from stock
Genuine parts
Verified sourcing
RoHS
Compliant
Support
Technical team support
Specifications
- Tepe Reflow Sıcaklığı (°C)
- 240
- Moisture Sensitive
- Yes
- Package Description
- FBGA-896
- Data Ram Size
- 64 kB
- Number Of Logic Array Blocks Labs
- 4695 LAB
- Core
- ARM Cortex M3
- Number Of Cores
- 1 Core
- Tedarikçi Cihaz Paketi
- 896-FBGA (31x31)
- Organization
- 48672 CLBS
- Terminal Formu
- BALL
- Package Shape
- SQUARE
- Supply Voltagenom
- 1.2 V
- Package Style
- GRID ARRAY
- Package Code
- BGA
- Yayın Yılı
- 2015
- Number Of Logic Cells
- 56340
- Terminal Pozisyonu
- BOTTOM
- Ürün Durumu
- Active
- Core Processor
- ARM® Cortex®-M3
- Rohs Code
- No
- Fabrika Tedarik Süresi
- 7 Weeks
- Number Of Clbs
- 48672
- Shipping Restrictions
- This product may require additional documentation to export from the United States.
- Peripherals
- DDR, PCIe, SERDES
- Package Equivalence Code
- BGA896,30X30,40
- Üretici Parça No
- M2S050-FG896I
- Primary Attributes
- FPGA - 50K Logic Modules
- Lifecycle Status
- IN PRODUCTION (Last Updated: 2 weeks ago)
- Maximum Clock Frequency
- 166 MHz
- Çalışma Sıcaklığı
- -40°C~100°C TJ
- JESD-609 Kodu
- e0
- Supply Voltagemax
- 1.26 V
- Number Of Outputs
- 377
- Technology
- CMOS
- Number Of Logic Elements
- 56340 LE
- Nem Hassasiyeti (MSL)
- 3 (168 Hours)
- Connectivity
- CANbus, Ethernet, I2C, SPI, UART/USART, USB
- Kılıf / Paket
- 896-BGA
- Ihs Manufacturer
- MICROSEMI CORP
- HTS Kodu
- 8542.39.00.01