Shipping
Same-day dispatch from stock
Genuine parts
Verified sourcing
RoHS
Compliant
Support
Technical team support
Specifications
- Package Shape
- SQUARE
- Terminal Formu
- BALL
- Supply Voltagenom
- 1.2 V
- Number Of Cores
- 1 Core
- Core
- ARM Cortex M3
- Tedarikçi Cihaz Paketi
- 325-FCBGA (11x11)
- Package Description
- FBGA-325
- Moisture Sensitive
- Yes
- Data Ram Size
- 64 kB
- Number Of Logic Array Blocks Labs
- 4695 LAB
- Tepe Reflow Sıcaklığı (°C)
- NOT SPECIFIED
- Supply Voltagemax Vsup
- 1.26V
- Rohs Code
- Yes
- Fabrika Tedarik Süresi
- 10 Weeks
- Shipping Restrictions
- This product may require additional documentation to export from the United States.
- Terminal Pozisyonu
- BOTTOM
- Besleme Gerilimi
- 1.2V
- Core Processor
- ARM® Cortex®-M3
- Ürün Durumu
- Active
- Terminal Sayısı
- 325
- Package Code
- TFBGA
- Yayın Yılı
- 2015
- Number Of Logic Cells
- 56340
- Package Style
- GRID ARRAY, THIN PROFILE, FINE PITCH
- Çalışma Sıcaklığı
- -40°C~100°C TJ
- Supply Voltagemax
- 1.26 V
- JESD-609 Kodu
- e3
- Number Of Outputs
- 200
- Maximum Clock Frequency
- 166 MHz
- Üretici Parça No
- M2S050-FCSG325I
- Primary Attributes
- FPGA - 50K Logic Modules
- Lifecycle Status
- IN PRODUCTION (Last Updated: 2 weeks ago)
- Peripherals
- DDR, PCIe, SERDES
- Additional Feature
- LG-MIN, WD-MIN
- Package Equivalence Code
- BGA325,21X21,20
- Montaj Stili
- SMD/SMT
- Fabrika Paket Adedi
- 176
- Flash Size
- 256KB
- Ihs Manufacturer
- MICROSEMI CORP
- HTS Kodu
- 8542.39.00.01