Shipping
Same-day dispatch from stock
Genuine parts
Verified sourcing
RoHS
Compliant
Support
Technical team support
Specifications
- Maximum Clock Frequency
- 166 MHz
- Çalışma Sıcaklığı
- -40°C~100°C TJ
- JESD-609 Kodu
- e0
- Number Of Outputs
- 180
- Peripherals
- DDR, PCIe, SERDES
- Additional Feature
- LG-MIN, WD-MIN
- Primary Attributes
- FPGA - 25K Logic Modules
- Lifecycle Status
- IN PRODUCTION (Last Updated: 2 weeks ago)
- Fabrika Paket Adedi
- 176
- Flash Size
- 256KB
- Montaj Stili
- SMD/SMT
- Number Of Logic Elements
- 27696 LE
- Nem Hassasiyeti (MSL)
- 3 (168 Hours)
- Connectivity
- CANbus, Ethernet, I2C, SPI, UART/USART, USB
- Kılıf / Paket
- 325-TFBGA, CSPBGA
- HTS Kodu
- 8542.39.00.01
- Core
- ARM Cortex M3
- Number Of Cores
- 1 Core
- Tedarikçi Cihaz Paketi
- 325-FCBGA (11x11)
- Terminal Formu
- BALL
- Tepe Reflow Sıcaklığı (°C)
- NOT SPECIFIED
- Supply Voltagemax Vsup
- 1.26V
- Moisture Sensitive
- Yes
- Data Ram Size
- 64 kB
- Number Of Logic Array Blocks Labs
- 2308 LAB
- Terminal Pozisyonu
- BOTTOM
- Besleme Gerilimi
- 1.2V
- Core Processor
- ARM® Cortex®-M3
- Ürün Durumu
- Active
- Terminal Sayısı
- 325
- Fabrika Tedarik Süresi
- 10 Weeks
- Shipping Restrictions
- This product may require additional documentation to export from the United States.
- Number Of Logic Cells
- 27696
- Paket
- Tray
- Tepe Reflow Süresi (maks. sn)
- NOT SPECIFIED
- Architecture
- MCU, FPGA
- Terminal Adımı
- 0.5mm
- Ram Size
- 64KB
- Number Of Ios
- 180
- Maks. Oturma Yüksekliği
- 1.01mm