Shipping
Same-day dispatch from stock
Genuine parts
Verified sourcing
RoHS
Compliant
Support
Technical team support
Specifications
- Number Of Logic Elements
- 27696 LE
- Nem Hassasiyeti (MSL)
- 3 (168 Hours)
- Technology
- CMOS
- Kılıf / Paket
- 325-TFBGA, CSPBGA
- Connectivity
- CANbus, Ethernet, I2C, SPI, UART/USART, USB
- Ihs Manufacturer
- MICROSEMI CORP
- Flash Size
- 256KB
- Fabrika Paket Adedi
- 176
- Montaj Stili
- SMD/SMT
- Package Equivalence Code
- BGA325,21X21,20
- Additional Feature
- LG-MIN, WD-MIN
- Peripherals
- DDR, PCIe, SERDES
- Lifecycle Status
- IN PRODUCTION (Last Updated: 2 weeks ago)
- Üretici Parça No
- M2S025TS-1FCSG325I
- Primary Attributes
- FPGA - 25K Logic Modules
- Maximum Clock Frequency
- 166 MHz
- JESD-609 Kodu
- e3
- Supply Voltagemax
- 1.26 V
- Çalışma Sıcaklığı
- -40°C~100°C TJ
- Number Of Outputs
- 180
- Package Style
- GRID ARRAY, THIN PROFILE, FINE PITCH
- Package Code
- TFBGA
- Number Of Logic Cells
- 27696
- Yayın Yılı
- 2015
- Besleme Gerilimi
- 1.2V
- Terminal Pozisyonu
- BOTTOM
- Terminal Sayısı
- 325
- Ürün Durumu
- Active
- Core Processor
- ARM® Cortex®-M3
- Fabrika Tedarik Süresi
- 10 Weeks
- Rohs Code
- Yes
- Shipping Restrictions
- This product may require additional documentation to export from the United States.
- Tepe Reflow Sıcaklığı (°C)
- NOT SPECIFIED
- Supply Voltagemax Vsup
- 1.26V
- Data Ram Size
- 64 kB
- Moisture Sensitive
- Yes
- Package Description
- FBGA-325
- Number Of Logic Array Blocks Labs
- 2308 LAB
- Core
- ARM Cortex M3
- Number Of Cores
- 1 Core