Shipping
Same-day dispatch from stock
Genuine parts
Verified sourcing
RoHS
Compliant
Support
Technical team support
Specifications
- Connectivity
- CANbus, Ethernet, I2C, SPI, UART/USART, USB
- Kılıf / Paket
- 325-TFBGA, CSPBGA
- Technology
- CMOS
- Nem Hassasiyeti (MSL)
- 3 (168 Hours)
- Number Of Logic Elements
- 27696 LE
- HTS Kodu
- 8542.39.00.01
- Ihs Manufacturer
- MICROSEMI CORP
- Fabrika Paket Adedi
- 176
- Flash Size
- 256KB
- Montaj Stili
- SMD/SMT
- Peripherals
- DDR, PCIe, SERDES
- Package Equivalence Code
- BGA325,21X21,20
- Additional Feature
- LG-MIN, WD-MIN
- Primary Attributes
- FPGA - 25K Logic Modules
- Üretici Parça No
- M2S025T-FCSG325I
- Lifecycle Status
- Production (Last Updated: 2 months ago)
- Maximum Clock Frequency
- 166 MHz
- Number Of Outputs
- 180
- Çalışma Sıcaklığı
- -40°C~100°C TJ
- JESD-609 Kodu
- e3
- Supply Voltagemax
- 1.26 V
- Package Style
- GRID ARRAY, THIN PROFILE, FINE PITCH
- Yayın Yılı
- 2015
- Number Of Logic Cells
- 27696
- Package Code
- TFBGA
- Core Processor
- ARM® Cortex®-M3
- Ürün Durumu
- Active
- Terminal Sayısı
- 325
- Terminal Pozisyonu
- BOTTOM
- Besleme Gerilimi
- 1.2V
- Shipping Restrictions
- This product may require additional documentation to export from the United States.
- Rohs Code
- Yes
- Fabrika Tedarik Süresi
- 10 Weeks
- Supply Voltagemax Vsup
- 1.26V
- Tepe Reflow Sıcaklığı (°C)
- NOT SPECIFIED
- Number Of Logic Array Blocks Labs
- 2308 LAB
- Package Description
- FBGA-325
- Moisture Sensitive
- Yes
- Data Ram Size
- 64 kB
- Tedarikçi Cihaz Paketi
- 325-FCBGA (11x11)