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Priced by quantity and lead time.
Shipping
Same-day dispatch from stock
Genuine parts
Verified sourcing
RoHS
Compliant
Support
Technical team support
Specifications
- Fabrika Tedarik Süresi
- 10 Weeks
- Rohs Code
- No
- Shipping Restrictions
- This product may require additional documentation to export from the United States.
- Besleme Gerilimi
- 1.2V
- Terminal Pozisyonu
- BOTTOM
- Terminal Sayısı
- 325
- Core Processor
- ARM® Cortex®-M3
- Msl
- MSL 3 - 168 hours
- Ürün Durumu
- Active
- Package Code
- TFBGA
- Number Of Logic Cells
- 27696
- Yayın Yılı
- 2015
- Package Style
- GRID ARRAY, THIN PROFILE, FINE PITCH
- Supply Voltagenom
- 1.2 V
- Terminal Formu
- BALL
- Package Shape
- SQUARE
- Core
- ARM Cortex M3
- Number Of Cores
- 1 Core
- Tedarikçi Cihaz Paketi
- 325-FCBGA (11x11)
- Data Ram Size
- 64 kB
- Moisture Sensitive
- Yes
- Package Description
- FBGA-325
- Number Of Logic Array Blocks Labs
- 2308 LAB
- Tepe Reflow Sıcaklığı (°C)
- NOT SPECIFIED
- Supply Voltagemax Vsup
- 1.26V
- Flash Size
- 256KB
- Fabrika Paket Adedi
- 176
- Ihs Manufacturer
- MICROSEMI CORP
- HTS Kodu
- 8542.39.00.01
- Number Of Logic Elements
- 27696 LE
- Nem Hassasiyeti (MSL)
- 3 (168 Hours)
- Technology
- CMOS
- Kılıf / Paket
- 325-TFBGA, CSPBGA
- Connectivity
- CANbus, Ethernet, I2C, SPI, UART/USART, USB
- JESD-609 Kodu
- e0
- Supply Voltagemax
- 1.26 V
- Çalışma Sıcaklığı
- 0°C~85°C TJ
- Number Of Outputs
- 180
- Maximum Clock Frequency
- 166 MHz
- Lifecycle Status
- Production (Last Updated: 2 months ago)