Shipping
Same-day dispatch from stock
Genuine parts
Verified sourcing
RoHS
Compliant
Support
Technical team support
Specifications
- Ambalaj
- Tray
- Number Of Ios
- MCU - 25, FPGA - 66
- Contact Style
- Socket
- Flash Size
- 512KB
- Architecture
- MCU, FPGA
- Seri
- SmartFusion®
- Shell Material
- Stainless Steel
- Çalışma Sıcaklığı
- -40°C~100°C TJ
- Kılıf / Paket
- 256-LBGA
- Montaj Tipi
- Wall - Front Mount - Thru Holes
- Parça Durumu
- Active
- Contact Sizes
- 53#20
- Shell Plating
- Electroless Nickel
- Service Rating
- I
- Tedarikçi Cihaz Paketi
- 256-FPBGA (17x17)
- Ram Size
- 64KB
- Insert Material
- Hard Dielectric
- Shielding
- Yes
- Temel Parça No
- A2F500M3G
- Insert Arrangement
- H53
- Core Processor
- ARM® Cortex®-M3
- Fabrika Tedarik Süresi
- 12 Weeks
- Connectivity
- EBI/EMI, Ethernet, I2C, SPI, UART/USART
- Sealing
- Meets IP67
- Peripherals
- DMA, POR, WDT
- Nem Hassasiyeti (MSL)
- 3 (168 Hours)
- Contact Plating
- 50 microinches Gold Plate
- Speed
- 100MHz
- Primary Attributes
- ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops
- RoHS Durumu
- Non-RoHS Compliant
- Contact Materials
- Copper Alloy