Shipping
Same-day dispatch from stock
Genuine parts
Verified sourcing
RoHS
Compliant
Support
Technical team support
Specifications
- Ürün Durumu
- Active
- Parça Durumu
- Active
- Çalışma Sıcaklığı
- -40°C~100°C TJ
- Kılıf / Paket
- 288-TFBGA, CSPBGA
- Package Style
- GRID ARRAY, THIN PROFILE, FINE PITCH
- Temel Parça No
- A2F500M3G
- Ram Size
- 64KB
- Number Of Terminals
- 288
- Terminal Pozisyonu
- BOTTOM
- Tepe Reflow Sıcaklığı (°C)
- 260
- Paket
- Tray
- Rohs Code
- Yes
- Terminal Formu
- BALL
- Uzunluk
- 11mm
- Package Equivalence Code
- BGA288,21X21,20
- Yüzey Montaj
- YES
- Primary Attributes
- ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops
- Frekans
- 100MHz
- Package Body Material
- PLASTIC/EPOXY
- Speed
- 100MHz
- Reflow Temperaturemax S
- 30
- Terminal Adımı
- 0.5mm
- Operating Supply Voltage
- 1.5V
- Jesd30 Code
- S-PBGA-B288
- Tepe Reflow Süresi (maks. sn)
- 30
- Connectivity
- EBI/EMI, Ethernet, I2C, SPI, UART/USART
- Temperature Grade
- INDUSTRIAL
- Package Shape
- SQUARE
- Moisture Sensitivity Levels
- 3
- Supply Voltagenom
- 1.5 V
- Ihs Manufacturer
- MICROSEMI CORP
- Yayın Yılı
- 2013
- Operating Temperaturemin
- -40 °C
- JESD-609 Kodu
- e1
- Nem Hassasiyeti (MSL)
- 3 (168 Hours)
- Peripherals
- DMA, POR, WDT
- Number Of Logic Cells
- 11520
- Supply Voltagemin
- 1.425 V
- Number Of Inputs
- 78
- Package Code
- TFBGA