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A2F200M3F-FGG256

Microsemi Corporation

A2F200M3F-FGG256

SoC

RoHS: Compliant

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Compliant

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Specifications

Number Of Registers
4608
Temel Parça No
A2F200
Min. Çalışma Sıcaklığı
0°C
Tedarikçi Cihaz Paketi
256-FPBGA (17x17)
Ram Size
64KB
Çalışma Sıcaklığı
0°C~85°C TJ
Kılıf / Paket
256-LBGA
Pin Sayısı
256
Parça Durumu
Active
Architecture
MCU, FPGA
Seri
SmartFusion®
Flash Size
256KB
Core Architecture
ARM
Ambalaj
Tray
Number Of Gates
200000
Max Supply Voltage
1.575V
Data Rate
400 kbps
Number Of Ios
MCU - 25, FPGA - 66
Operating Supply Voltage
1.5V
Memory Size
4.5kB
Radyasyon Dayanımı
No
Max Frequency
100MHz
Number Of Logic Elementscells
2500
RoHS Durumu
RoHS Compliant
Speed
80MHz
Primary Attributes
ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops
Frekans
80MHz
Min Supply Voltage
1.425V
Operating Supply Current
7mA
Peripherals
DMA, POR, WDT
Nem Hassasiyeti (MSL)
3 (168 Hours)
Interface
EBI/EMI, Ethernet, I2C, SPI, UART, USART
Fabrika Tedarik Süresi
12 Weeks
Maks. Çalışma Sıcaklığı
85°C
Connectivity
EBI/EMI, Ethernet, I2C, SPI, UART/USART
Core Processor
ARM® Cortex®-M3
Yayın Yılı
2011

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