W3H128M72E-667SBM

Specifications

Eccn Us

4A994.a

Chip Density Bit

1.8G

Maximum Clock Rate Mhz

667

Ecc Support

Yes

Spd Eeprom Support

No

Pll

No

Supplier Temperature Grade

Military

Organization

128Mx72

Typical Operating Supply Voltage V

1.8

Maximum Operating Supply Voltage V

1.9

Number Of Chip Banks

8

Minimum Operating Supply Voltage V

1.7

Max Access Time Ns

1.25

Minimum Operating Temperature C

-55

RoHS Durumu

Supplier Unconfirmed

Cas Latency

6

Mounting

Surface Mount

Self Refresh

Yes

Package Length

22.1(Max)

Supplier Package

BGA

Maximum Operating Temperature C

125

Module

DRAM Module

Package Height

4.57(Max)

Package Width

16.1(Max)

Operating Current Ma

1375

Pcb Changed

208

Number Of Chip Per Module

5

Chip Package Type

PBGA

Pin Sayısı

208

Parça Durumu

Active

Module Density

1Gbyte

Data Bus Width Bit

72