W3E64M72S-266SBM

Specifications

Package Style

GRID ARRAY

Access Mode

FOUR BANK PAGE BURST

Fonksiyon Sayısı

1

Supply Voltagenom Vsup

2.5 V

Memory Density

4831838208 bit

Terminal Adımı

1.27 mm

Access Timemax

0.75 ns

Qualification Status

Not Qualified

Supply Voltagemax Vsup

2.7 V

Memory Ic Type

DDR DRAM

Package Description

BGA,

Package Shape

RECTANGULAR

Operating Mode

SYNCHRONOUS

Self Refresh

YES

Operating Temperaturemin

-55 °C

Temperature Grade

MILITARY

Number Of Words

67108864 words

Ihs Manufacturer

MERCURY SYSTEMS INC

HTS Kodu

8542.32.00.36

Operating Temperaturemax

125 °C

Number Of Words Code

64000000

REACH Uyumluluk Kodu

unknown

Tepe Reflow Sıcaklığı (°C)

225

Additional Feature

AUTO/SELF REFRESH

Part Life Cycle Code

Contact Manufacturer

Number Of Ports

1

Terminal Pozisyonu

BOTTOM

Reflow Temperaturemax S

30

Terminal Formu

BALL

Organization

64MX72

Number Of Terminals

219

Üretici Parça No

W3E64M72S-266SBM

Risk Rank

5.26

Supply Voltagemin Vsup

2.3 V

Memory Width

72

Yüzey Montaj

YES

ECCN Kodu

EAR99

Package Code

BGA

Jesd30 Code

R-PBGA-B219

Package Body Material

PLASTIC/EPOXY