W3E32M72SR-266SBI

Specifications

Package Body Material

PLASTIC/EPOXY

Part Package Code

BGA

Yüzey Montaj

YES

ECCN Kodu

EAR99

Package Code

BGA

Jesd30 Code

R-PBGA-B208

Memory Width

72

Supply Voltagemin Vsup

2.3 V

Risk Rank

5.21

Üretici Parça No

W3E32M72SR-266SBI

Number Of Terminals

208

Terminal Formu

BALL

Organization

32MX72

Terminal Kaplaması

Tin/Lead (Sn/Pb)

Reflow Temperaturemax S

NOT SPECIFIED

Terminal Pozisyonu

BOTTOM

Number Of Ports

1

Part Life Cycle Code

Transferred

Additional Feature

AUTO/SELF REFRESH

Tepe Reflow Sıcaklığı (°C)

NOT SPECIFIED

REACH Uyumluluk Kodu

compliant

Number Of Words Code

32000000

Operating Temperaturemax

85 °C

HTS Kodu

8542.32.00.36

Ihs Manufacturer

MICROSEMI CORP

Temperature Grade

INDUSTRIAL

Operating Temperaturemin

-40 °C

Number Of Words

33554432 words

Self Refresh

YES

JESD-609 Kodu

e0

Operating Mode

SYNCHRONOUS

Package Shape

RECTANGULAR

Package Description

BGA,

Memory Ic Type

DDR DRAM

Supply Voltagemax Vsup

2.7 V

Qualification Status

Not Qualified

Access Timemax

0.75 ns

Memory Density

2415919104 bit

Supply Voltagenom Vsup

2.5 V

Fonksiyon Sayısı

1