W3E32M72S-266BM

Specifications

RoHS Durumu

Supplier Unconfirmed

Cas Latency

2.5

Package Length

32.1(Max)

Self Refresh

Yes

Mounting

Surface Mount

Supplier Package

BGA

Maximum Operating Temperature C

125

Operating Current Ma

2000

Package Width

25.1(Max)

Module

DRAM Module

Package Height

2.03(Max)

Pcb Changed

219

Number Of Chip Per Module

5

Chip Package Type

PBGA

Pin Sayısı

219

Data Bus Width Bit

72

Module Density

256Mbyte

Eccn Us

4A994.a

Chip Density Bit

460.8M

Ecc Support

Yes

Maximum Clock Rate Mhz

266

Spd Eeprom Support

No

Supplier Temperature Grade

Military

Pll

No

Organization

32Mx72

Typical Operating Supply Voltage V

2.5

Maximum Operating Supply Voltage V

2.7

Minimum Operating Supply Voltage V

2.3

Number Of Chip Banks

4

Max Access Time Ns

0.75

Minimum Operating Temperature C

-55