W332M64V-100SBI

Specifications

Package Style

GRID ARRAY

Ihs Manufacturer

MICROSEMI CORP

Seated Heightmax

2.77 mm

Operating Mode

SYNCHRONOUS

Max Access Time Ns

7

Package Body Material

PLASTIC/EPOXY

Terminal Pozisyonu

BOTTOM

Part Package Code

BGA

Yüzey Montaj

YES

Pin Sayısı

208

Pcb Changed

208

Package Width

13.15(Max)

Chip Package Type

PBGA

Maximum Operating Temperature C

85

ECCN Kodu

EAR99

Kurşunsuz Kodu

No

Number Of Ports

1

Additional Feature

AUTO/SELF REFRESH; LG-MAX; WD-MAX; SEATED HT-CALCULATED

Rohs Code

No

REACH Uyumluluk Kodu

unknown

Terminal Formu

BALL

Mounting

Surface Mount

Module

DRAM Module

Cas Latency

3|2

Jesd30 Code

R-PBGA-B208

Operating Temperaturemin

-40 °C

Self Refresh

Yes

Temperature Grade

INDUSTRIAL

Package Height

2.27(Max)

Tepe Reflow Sıcaklığı (°C)

225

Maximum Operating Supply Voltage V

3.6

Refresh Cycles

8K

Spd Eeprom Support

No

Number Of Chip Banks

4

Supplier Temperature Grade

Industrial

Number Of Words

33554432 words

Supplier Package

BGA

Memory Width

64

Pll

No

Part Life Cycle Code

Transferred